Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-volume Set)

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Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-volume Set)

by Avram Bar-cohen

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4.6 out of 5

Creators

Author Avram Bar-cohen

Publisher World Scientific Publishing Co Pte Ltd

Synopsis Thermal and mechanical packaging the enabling technologies for the physical implementation of electronic systems are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and gradua

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Binding: Hardcover

About the author About the Author Boris M Abramzon is currently an independent consultant in the field of electronic cooling equipment, compact heat exchangers and airborne environmental control systems. He has taught several professional courses on compact heat exchangers and electronics cooling for engineers, and graduate and postgraduate courses on thermal analysis and design of electronic equipment at the Ben-Gurion University of the Negev and Tel Aviv University. He holds a Master of Science degree in thermo-physics from the Leningrad Polytechnic Institute, Russia, and a PhD in Mechanical Engineering from the Ben-Gurion University of the Negev, Israel. From 1984 to 1987 he was a Research Associate at the University of California, Irvine. From 1990 to 2001, he was a Head of the Heat Transfer Group at TAT Technologies, Ltd. From 2001 to 2011, he was a Senior Thermal Analyst at ELOP Electro-Optics Industries, Ltd. Dr Abramzon has published over 50 conference and journal papers in areas of heat transfer, chemical technology, combustion theory, electronics cooling and numerical optimization. About the Editor in Chief Dr Avram Bar-Cohen is an internationally recognized leader in thermal science and technology, Life Fellow of IEEE, an honorary member of ASME, and is currently serving as a Principal Engineering Fellow at Raytheon Corporation ? Space and Airborne Systems, USA. His publications, lectures, short courses, and research, as well as his US government and professional service in IEEE and ASME, have helped to create the scientific foundation for the thermal management of electronic components and systems. His current efforts focus on the system and thermal architecture of power beaming and other directed energy systems. He also continues to pursue embedded cooling, including on-chip thermoelectrics, two-phase microchannel coolers, and diamond thermal substrates for high heat flux electronic and photonic components in computational, RF, and laser systems.

Specifications

Language: English
Publisher: World Scientific Publishing Co Pte Ltd
Pages: 904 pages
Binding: Hardcover

ISBN: 9789813239661
Category: Engineering
Related Category: International Exams