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Home Academics Engineering Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
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Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
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Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

by Avram Bar-cohen, Jeffrey C Suhling, et al.
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Author Avram Bar-cohen, Jeffrey C Suhling, et al.
Publisher World Scientific Publishing Co Pte Ltd
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Binding: Hardcover
About the author
Specifications
  • Language: English
  • Publisher: World Scientific Publishing Co Pte Ltd
  • Pages: 1080 pages
  • Binding: Hardcover
  • ISBN: 9789811201110
  • Category: Engineering
  • Related Category: International Exams
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