Design And Modeling For 3d Ics And Interposers: 2 (Wspc Series In Advanced Integration And Packaging)

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Design And Modeling For 3d Ics And Interposers: 2 (Wspc Series In Advanced Integration And Packaging)

Name: Design And Modeling For 3d Ics And Interposers: 2 (Wspc Series In Advanced Integration And Packaging)
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Rating: 4.8 (47 reviews)
Author: Madhavan Swaminathan and Ki Jin Han
ISBN: 9789814508599

by Madhavan Swaminathan and Ki Jin Han

4.8

4.8 out of 5

Creators

Author Madhavan Swaminathan and Ki Jin Han

Publisher World Scientific Publishing Co Pte Ltd

Synopsis 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

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Binding: Hardcover

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Specifications

Language: English
Publisher: World Scientific Publishing Co Pte Ltd
Pages: 380 pages
Binding: Hardcover

ISBN: 9789814508599
Category: Engineering
Related Category: International Exams